Power Module with Additional Low Inductive Current Path
Conference: CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
03/16/2010 - 03/18/2010 at Nuremberg, Germany
Proceedings: CIPS 2010
Pages: 6Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Frisch, Michael (Vincotech GmbH, Biberger Str. 93, 82008 Unterhaching, Germany)
Ernö, Temesi (Vincotech Kft., Kossuth Lajos u. 59, 2060 Bicske, Hungary)
Parasitic inductances are a major problem with power modules, in particular in fast switching applications. The parasitic inductance of the component interconnections causes an overvoltage condition and increases the switch-off losses in the semiconductor. Many initiatives have been investigated to reduce the parasitic inductance in power modules utilizing a complex mechanical construction of overlapping internal bus bars forming the DC path. An alternative to this approach, which is outlined within this writing, is a concept using today’s standard power module construction but providing an additional ultra low inductive path for the transient current.