Novel Silver Contact Paste Lead Free Solution for Die Attach
Conference: CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
03/16/2010 - 03/18/2010 at Nuremberg, Germany
Proceedings: CIPS 2010
Pages: 6Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Schmitt, Wolfgang (W.C. Heraeus GmbH, Hanau, Germany)
Heraeus has developed a novel concept for silver sinter pastes. The new concept uses well known micro scale silver particle technology combined with sinter additives. The novel pastes have higher sinter activity than nano-silver pastes and a can be used in pressureless or low pressure bonding processes. The physical properties such as shear strength at temperature above 200deg C, electrical and thermal conductivity are outstanding compared to solder or silver adhesives. The new paste concept can reduce the pressure required for "Low Temperature Joining Technology", is an alternative to nano-scaled silver pastes and can be potential lead free solutions for die attach applications. A large variety of applications are possible.