Innovative materials of automotive power packaging

Conference: CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
03/16/2010 - 03/18/2010 at Nuremberg, Germany

Proceedings: CIPS 2010

Pages: 7Language: englishTyp: PDF

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Tan, Ky Lim; Vivet, Laurent; Morelle, Jean Michel (Valeo, Creteil, France)
Pierre, Bertrand (Griset, Villers St Paul, France)
Bienvenu, Yves; Kaabi, Abderrahmen (Armines, Evry, France)

Automotive industries require new technologies to fulfil the electrical and hybrid vehicle applications. The current substrate materials for power module are not suitable for these applications because of the performance (mismatch in CTE for copper lead frame for instance) and the cost (high manufacturing cost and poor machinability for DBC AlN substrate for instance). The aim of the investigation is to develop multi functional materials that achieve the high performance in the thermal, electrical and mechanical properties required by the hybrid and electrical vehicle application while satisfying high volume production constraints. The development is focused on the composite and co-laminated materials that can improve thermal, mechanical and electrical characteristics while adapting to automotive lean manufacturing.