System Approach for Reliability of Low-power Power Electronics; How to Break Down into Their Constructed Parts
Conference: CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
03/06/2012 - 03/08/2012 at Nuremberg, Germany
Proceedings: CIPS 2012
Pages: 5Language: englishTyp: PDF
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Authors:
Tarashioon, S. (Materials innovation institute (M2i), Mekelweg 2, 2628 CD Delft, The Netherlands)
Tarashioon, S.; Driel, W. D. van; Zhang, G. Q. (Dimes Center for SSL Technologies Micro/Nanoelectronics System Integration and Reliability , Delft University of Technology, Feldmannweg 17, 2628 CT Delft, The Netherlands)
Abstract:
This paper presents a new method for breaking down a low-power power electronics device into its constructed parts used for reliability study of the device. The exceptional feature of this new method is to break down the device into two main parts: function elements and packaging elements. This method can help for a much better prioritizing the failures in the device, and also with having more structured reliability procedure it will be more possibility to apply it in a computer program. The advantage of this method over the existing methods is discussed and also how it can be applied for studying reliability of whole system.