Direct cooled modules - integrated heat sinks
Conference: CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
03/06/2012 - 03/08/2012 at Nuremberg, Germany
Proceedings: CIPS 2012
Pages: 4Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Hohlfeld, Olaf; Herbrandt, Alexander (Infineon Technologies AG, Max-Planck-Str. 5, 59581 Warstein, Germany)
Various cooling structures suitable for integrated water cooling including pin fin, folded and bonded structures have been compared. A jointing method has been presented, that allows the reliable mounting of substrates onto aluminium structures. A demonstrator with a cooling structure was manufactured and its reliability was tested.