3-Dimensional, Solder-Free Interconnect Technology for High-Performance Power Modules

Conference: CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
03/06/2012 - 03/08/2012 at Nuremberg, Germany

Proceedings: CIPS 2012

Pages: 6Language: englishTyp: PDF

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Mouawad, Bassem; Buttay, Cyril; Soueidan, Maher; Morel, Hervé; Allard, Bruno (Université de Lyon, INSA de Lyon, AMPERE-UMR 5005, Bât. L. de Vinci, 21 Av. J. Capelle, 69621 Villeurbanne Cedex, France)
Fabrègue, Damien (Université Lyon, INSA de Lyon, MATEIS-UMR 5510, Bât. B. PASCAL,7 Av. J. Capelle, 69621 Villeurbanne Cedex, France)
Bley, Vincent (Université de Toulouse, UPS, INPT, LAPLACE 118, route de Narbonne, 31062 Toulouse, France)

The classical wire bonding has several drawbacks that make 3D structures a desirable technology for a high performance power module. An interconnection solution for the power semiconductor dies is presented here: it is based on copper micro-posts that are electroplated on top of the die. The die with its micro-posts is then assembled between two Direct Bonded Copper (DBC) substrates using a direct copper-to-copper bond method. This direct bond method is achieved using a Spark Plasma Sintering (SPS) process machine. Manufacturing and electrical characterization of a power semiconductor die with the micro-posts interconnection is presented in details.