Reliability of Planar SKiN Interconnect Technology
Conference: CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
03/06/2012 - 03/08/2012 at Nuremberg, Germany
Proceedings: CIPS 2012
Pages: 8Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Scheuermann, Uwe (SEMIKRON Elektronik GmbH & Co. KG, Nuremberg, Germany)
The classical module design is limited in lifetime by solder interfaces and wire bond technology. The elimination of the traditional base plate and the replacement of solder interfaces by a high reliable Ag sinter technology led to the first 100% solder free module. The SKiN technology eliminates the last obstacle to a significant lifetime and reliability improvement: the wire bonds. It additionally replaces the interface to the heat sink by an Ag sinter interconnect and thus allows a very compact and light design of power electronic systems.