Comparison between electromagnetic and thermal stress induced by Direct Current flow in IGBT bond wires

Conference: CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
03/06/2012 - 03/08/2012 at Nuremberg, Germany

Proceedings: CIPS 2012

Pages: 6Language: englishTyp: PDF

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Medjahed, H.; Vidal, P.-E. (Université de Toulouse, INP Toulouse, LGP, 47 avenue d’Azereix 65016 TARBES Cedex, France)
Nogarede, B. (Université de Toulouse, INP Toulouse, LAPLACE - CNRS UMR 5213, 2, rue Charles Camichel BP 7122, 31071 Toulouse Cedex 7, France)

This study is focused on the IGBT wire bond behaviour. We apply a direct current flow within the wire to reproduce the thermal cycling test used in reliability studies. On one hand we compare the temperature distribution between 3D FEM simulation and the experimental temperature measurement. We also point out the Von-Mises stress obtained. On the other hand we compare the thermo-mechanical results to those obtained with a 1D simplified thermal model. We also take into account the electromagnetic force and the mechanical stress that could be induced on the bond wire. Some experimental and simulation results are given.