Development and Testing of Cold gas Sprayed Circuit Boards for Power Electronics Applications

Conference: CIPS 2012 - 7th International Conference on Integrated Power Electronics Systems
03/06/2012 - 03/08/2012 at Nuremberg, Germany

Proceedings: CIPS 2012

Pages: 6Language: englishTyp: PDF

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Rastjagaev, Eugen; Wilde, Jürgen (University of Freiburg, Institute for Microsystem Technology (IMTEK), Department for Assembly and Packaging Technology, Georges-Koehler-Allee 103, 79110 Freiburg, Germany)
Wielage, Bernhard; Grund, Thomas; Kümmel, Sabine (Technical University of Chemnitz, Institute for Materials Science, Department of composite materials, Erfenschlager Straße 73, 09125 Chemnitz, Germany)

Within the framework of the presented project, new mounting concepts for power electronics were implemented by applying Al/Cu coat systems to insulators by means of cold gas spraying (CGS). The layers sprayed with cold gas were investigated and good material properties are observed. The applied metallizations show an extremely small porosity, no thermally induced phase conversions or process-related oxides and a high adhesive strength. Also the processing of assemblies with standard processes such as a soldering, adhesive bonding and heavy wire bonding is possible. The temperature shock stability of the new substrates was determined in temperature cycle experiments and it was compared with the temperature shock stability of the DCB substrates. The substrates were tested actively but also passively in bicameral temperature shock chamber and in power cycling experiments at power electronic function samples. The accomplished reliability investigations showed that the characteristic lifetime of the cold gas sprayed substrates is approximately 80% of the characteristic lifetime of the DCB substrates. These demonstrate that the substrates produced in cold-gas technology can be used for power electronic applications.