CMOS Transistors under Uniaxial Stress on Ultra-Thin Chips for Applications in Bendable Image Sensors
Conference: PRIME 2012 - 8th Conference on Ph.D. Research in Microelectronics & Electronics
06/12/2012 - 06/15/2012 at Aachen, Germany
Proceedings: PRIME 2012
Pages: 4Language: englishTyp: PDF
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Authors:
Häfner, J.; Mokwa, W. (Institute of Materials in Electrical Engineering I, RWTH Aachen University, Aachen, Germany)
Dogiamis, G.; Hosticka, B.; Grabmaier, A. (Chair of Electronic Devices and Circuits (EBS), University Duisburg-Essen, Duisburg, Germany)
Abstract:
In this work characteristics of CMOS transistors on ultra-thin silicon chips embedded into a polyimide foil are discussed. The thinning and the encapsulation processes are presented and the piezoresistive coefficients of both n- and pMOS transistors are experimentally determined. Moreover, the dependence of the threshold voltage and subthreshold slope on uniaxial tensile and compressive stress is examined. Keywords - flexible ultra-thin silicon chips; uniaxial stress; bending machine;piezoresistance; chip-in-foil