Chemical Mechanical Polishing Slurry for Aluminum Substrate
Conference: ICPT 2012 - International Conference on Planarization / CMP Technology
10/15/2012 - 10/17/2012 at Grenoble, France
Proceedings: ICPT 2012
Pages: 3Language: englishTyp: PDF
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Authors:
Wang, Liangyong; Liu, Weili; Song, Zhitang (Shanghai Institute of Microsystem and Information Technology, CAS, 865 Changning Road, Shanghai 200050, PR China )
Abstract:
Aluminum substrate is widely used for the applications of cell phones, tablets and so on. To meet the stringent requirement of surface quality, chemical mechanical polishing (CMP) slurry is needed for processing aluminum substrate. However, imperfections like scratches, projections, contaminations, pits, can easily occur during Al CMP. In this study, we optimized our slurry and achieved Al CMP with minimized imperfections. Keywords: chemical mechanical polishing, aluminum substrate, slurry