Required by the application - Optimized joining technologies in IGBT modules increases the lifetime of hybrid bus inverters

Conference: Internationaler ETG-Kongress 2013 – Energieversorgung auf dem Weg nach 2050 - Symposium 1: Security in Critical Infrastructures Today
11/05/2013 - 11/06/2013 at Berlin, Deutschland

Proceedings: Internationaler ETG-Kongress 2013 – Energieversorgung auf dem Weg nach 2050

Pages: 6Language: englishTyp: PDF

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Authors:
Rusche, Wilhelm; Krasel, Sandra; Koray, Yilmaz; Oeschler, Niels (Infineon Technologies AG, Warstein, Germany)
Helsper, Martin; Rüger, Niklas (Siemens AG, Nuremberg, Germany)

Abstract:
Target of the research project presented in this paper is to find an appropriate solution to increase the ruggedness/reliability of the system soldering in a power module and the implementation in an existing design. Accelerated reliability tests, passive thermal cycling (TC) and thermal shock tests (TST) are performed to estimate the reliability of the improved solder connections. The differences in the aging of the layers depending on the load applied and the influence on the failure mechanism will be shown. The results are compared by analyzing Scanning Acoustic Microscopy (SAM) images. The focus is on reliability and how the improved joining technology employed in the device will in-crease the system lifetime of an inverter in a hybrid bus. The lifetime calculation is based on a real traction cycle, measured for a series hybrid drive city bus inverter with a liquid cooling system.