Robustness study of solder joints of different compositions by using Stochastic Finite Element Modeling

Conference: CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
02/25/2014 - 02/27/2014 at Nuremberg, Germany

Proceedings: ETG-Fb. 141: CIPS 2014

Pages: 7Language: englishTyp: PDF

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Authors:
Aoues, Younes; Makhloufi, Abderahman; El-Hami, Abdelkhalak (National Institute Of Applied Sciences at Rouen (INSA-LOFIMS), 685 Avenue de l’Universite, Saint Etienne de Rouvray, 76801, France)
Pougnet, Philippe (Reliability Expert Valeo, 14 av Beguines, 95800 Cergy, France)

Abstract:
Fatigue lifetime of eutectic SnPb and lead free solder joints is usually evaluated by deterministic models. These models do not take into account the uncertainties of model parameters, the variability of design parameters and the variability of operating conditions in service. In order to assess more accurately the robustness of critical solder joints of an automotive mechatronic device, a stochastic finite element model of solder joints is developed and its results are analyzed.