Manufacturability and Reliability Assessment of Power Sandwich Technology

Conference: CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
02/25/2014 - 02/27/2014 at Nuremberg, Germany

Proceedings: ETG-Fb. 141: CIPS 2014

Pages: 6Language: englishTyp: PDF

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Authors:
Josifovic, I.; Popovic-Gerber, J.; Ferreira, J.A. (Delft University of Technology, 2628CD Delft, The Netherlands)
Huesgen, T.; Mengotti, E.; Drofenik, U. (ABB Switzerland Ltd, Corporate Research, CH-5405 Baden-Daettwil, Switzerland)

Abstract:
This manuscript presents the experimental results of manufacturability and reliability assessment of Power Sandwich technology with x-dimension components. Manufacturability of Power Sandwich is investigated with accent on the soldering x-dimension components between printed circuit boards. The phase-change soldering is, through number of experiments, proven to be effective method for soldering large components within relatively complex Power Sandwich assemblies. Reliability of Power Sandwich is assessed by highly-accelerated-life-tests (HALT) and thermal cycling experiments under multiply number of constructed EMI filter test samples. The preliminary thermal cycling tests (after 1200 cycles) do not reveal failure neither of solder joints nor of components in EMI filters. However, the component electric properties are expected to degrade over time as observed through drift in initial measurements of EMI filter transfer function.