High Temperature Discrete Integrated Coreless Signal Insulator

Conference: CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
02/25/2014 - 02/27/2014 at Nuremberg, Germany

Proceedings: ETG-Fb. 141: CIPS 2014

Pages: 4Language: englishTyp: PDF

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Bergogne, Dominique; Martin, Christian; Allard, Bruno (Universite de Lyon, Ampere-lab, Lyon, France)
El Falahi, Khalil; Picun, Gonzalo (X-Rel Semiconductors, Grenoble, France)
Ezzeddine, Hilal; Pintout, Cedric (ST-Microelectronics, Tours, France)

For a few years now, some industrialists have been proposing commercial devices to realize the insulation of control signals in power conversion systems. Those devices have been used widely in the field with entire satisfaction. However, for some applications where extreme temperature requirements must be met, those components may not be adequate. In this paper, a discrete solution is presented using three chips: a transmitter, a coreless transformer and a receiver. The transformer chip is built using a copper on glass technology while transceivers and receivers use Silicon On Insulator. Operation with a Pulse Width Modulated signal is presented, the coreless technology was tested at 200°C.