Investigation on AlCu-clad base plates and a new by-pass cooler for pin fin power modules

Abstract:
In this paper prototypes with AlCu clad base plates based on HybridPACK(exp TM) 2 and an industrial power module are investigated. The bending of the base plate during the system soldering process is simulated in order to identify the route causes for the thermo mechanical stress of AlCu clad base plates and other copper materials. These findings are an important input for optimizing the yield of system soldering process and to figure out the optimal bases plate sizing for AlCu clad applications. Furthermore the thermal characterization of the prototypes shows a δ T between chip temperatures of 12°C. A new by-pass cooler is used to equalize chip temperatures along the module and to reduce the pressure drop in comparison to an ordinary cooler of more than 50%.