A Simple Method to Evaluate Substrate Layout for Power Modules

Conference: CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
02/25/2014 - 02/27/2014 at Nuremberg, Germany

Proceedings: ETG-Fb. 141: CIPS 2014

Pages: 6Language: englishTyp: PDF

Personal VDE Members are entitled to a 10% discount on this title

Authors:
Zhu, Nan; Chen, Min; Xu, Dehong (Department of Electrical Engineering, Zhejiang University, Hangzhou, China)

Abstract:
This paper aims to provide a simple and convenient method to evaluate substrate layout design for power modules. By identifying the critical commutation paths and defining an indicator of commutation loop inductance, the stray inductances of a substrate layout can be easily evaluated without the time consuming finite element analysis (FEA). A case study of the layout design of a half-bridge IGBT module is carried out. Several different substrate layout designs are evaluated by this method. Stray inductances calculated by FEA tool confirm the effectiveness of the proposed evaluation method. IGBT modules adopting the best layout design are fabricated. And tests have been done upon the fabricated IGBT module sample to verify its low stray inductances.