Packaging and Reliability of Power Modules

Conference: CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
02/25/2014 - 02/27/2014 at Nuremberg, Germany

Proceedings: ETG-Fb. 141: CIPS 2014

Pages: 8Language: englishTyp: PDF

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Authors:
Lutz, Josef (Chemnitz University of Technology, Germany)

Abstract:
Power cycling capability is the main reliability criterion for power modules. Weak points and fatigue processes are pointed-out. Power cycling tests are described, and are discussed regarding the influence of the test method to the results. Existing models for power cycling lifetime prediction are discussed regarding their usability and limits. Going from Si to SiC will be more challenging for the packaging technology. New technologies promise a large progress. Even the potential for modules with specification of the power cycling up to a junction temperature Tvjmax = 200°C is visible.