Simultaneous Testing of Wirebond and Solder Fatigue in IGBT Modules

Conference: CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
02/25/2014 - 02/27/2014 at Nuremberg, Germany

Proceedings: ETG-Fb. 141: CIPS 2014

Pages: 5Language: englishTyp: PDF

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Authors:
Riedel, G. J.; Valov, M. (ABB Switzerland Ltd., Corporate Research, 5405 Baden-Daettwil, Switzerland)

Abstract:
Long-term reliability is a key requirement for IGBT modules. Wire bond and solder degradation are main aging mechanisms in IGBT modules. Here both failure modes are addressed in a single test. This combined test is closer to real applications than individual tests and it saves time and reduces number of samples needed. Furthermore, cycling capability information for large temperature swings is extracted. This becomes more and more relevant as junction temperatures are being pushed to higher and higher values, for both, Si and wide band gap devices.