A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography
Conference: CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
02/25/2014 - 02/27/2014 at Nuremberg, Germany
Proceedings: ETG-Fb. 141: CIPS 2014
Pages: 5Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Agyakwa, Pearl A.; Yang, Li; Corfield, Martin R.; Johnson, C. Mark (Department of Electrical & Electronic Engineering, The University of Nottingham, University Park, Nottingham, NG7 2RD, UK)
This paper concerns the non-destructive visualisation of the evolution of damage within ultrasonically bonded aluminium wires using three dimensional x-ray computed tomography. We demonstrate the potential to observe the progressive accumulation of damage within the same wires during passive thermal cycling between -55°C and 190°C. Tomography datasets were obtained prior to and after cycling. Cracks could be seen emerging from the extreme ends of the bonds when imaged after 105 cycles. Subsequent cycling lead to the advancement of these cracks toward the centres of the bonds. In addition, damage developed within the interior of the bonds; these also grew with increase in number of cycles, and merged with existing cracks. Virtual cross-sections have been analysed to quantify the rate of damage build up.