High Temperature Compatibility of Interface between Al Ribbon and Au finished DBC Substrate

Conference: CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
02/25/2014 - 02/27/2014 at Nuremberg, Germany

Proceedings: ETG-Fb. 141: CIPS 2014

Pages: 3Language: englishTyp: PDF

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Park, Semin; Nagao, Shijo; Suganuma, Katsuaki (Inst. Sci. Indus. Res., Osaka Univ., Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan)

Metal ribbon wiring and its direct bonding attract much attention for next generation power electronics interconnection technology, as the wide capacity of electrical current compared to the typical thick string wires. In the power electronics under a high current operating condition, high temperature above 200 °C can be reached at the wire joints. The mechanical defects at thick wire joints in high temperature conditions become critical issue because the joints failure has been occurred by corrosion and intermetallic compounds (IMCs) growth. The mechanical properties at high temperatures are actually the major reasons to introduce ribbons replacing with thick wires. The effect of the high temperature on the bond interfaces have been investigated with field emission-scanning electron microscopy (FE-SEM) and energy-dispersive spectroscopy (EDS) analysis. We would propose detail specifications of 200 °C aging condition, by evaluating the mechanical strength of the bonding interface, microstructure analysis, and thermal reliability tests.