Improved thermal cycling reliability of ZTA (Zirconia Toughened Alumina) DBC substrates by manipulating metallization properties

Conference: CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
02/25/2014 - 02/27/2014 at Nuremberg, Germany

Proceedings: ETG-Fb. 141: CIPS 2014

Pages: 9Language: englishTyp: PDF

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Authors:
Park, Junhee; Kim, Minseok (KCC Corporation, Korea)
Roth, Alexander (KCC Europe GmbH, Germany)

Abstract:
Thermal Resistance and mechanical strength is one of the most important characteristic in the application of power module. Metal-Ceramic substrates (DBC, DAB, AMB) have been important packaging components in multichip power modules for reliable automotive operation. There is some concern about thermal characteristic and reliability due to the difference of ceramic yield strength and metallization. One well known approach is to use softer metallization, e.g. Aluminum based DAB substrates, at the cost of a change in interconnection processes (e.g. soldering) and performance (electrical and thermal conductivity). This paper presents the improved ZTA (Zirconia Toughened Alumina) DBC substrates by manipulating copper properties and ceramic structure with fine grain size, and a similar effect can be shown to improve thermal cycling performance