Foil Based Transient Liquid Phase Bonding as a Die-Attachment Method for High Temperature Devices
Conference: CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
02/25/2014 - 02/27/2014 at Nuremberg, Germany
Proceedings: ETG-Fb. 141: CIPS 2014
Pages: 6Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Bajwa, A. A.; Qin, Y. Y.; Zeiser, R.; Wilde, J, (Laboratory for Assembly and Packaging Technology, Department of Microsystems Engineering, University of Freiburg, Germany)
In this study, a foil-based transient liquid phase (TLP) bonding method is proposed as a die-attachment technique for high temperature devices. Silver-indium and silver-tin based binary systems are investigated for high temperature die bonds. An electroplating method was used for producing multi-layered foils as TLP bonding material. In this work, an optimization and characterization of the process was performed. Local microstructure and composition of the TLP bonded joints were studied using SEM and EDX. The bonding layers of Ag-In and Ag-Sn joints proved to be uniform and virtually void-free. The shear strength of the die-attachments exceeds the requirements of usual test standard. The die-attachment stresses induced by the TLP bonding process are analyzed using optical investigation technique such as digital image correlation (DIC).