New power-module structures consisting of both Cu and Al bonded to AlN substrates with an Al base plate

Conference: CIPS 2014 - 8th International Conference on Integrated Power Electronics Systems
02/25/2014 - 02/27/2014 at Nuremberg, Germany

Proceedings: ETG-Fb. 141: CIPS 2014

Pages: 5Language: englishTyp: PDF

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Authors:
Terasaki, Nobuyuki; Nagatomo, Yoshiyuki; Nagase, Toshiyuki; Kuromitsu, Yoshirou (Central Research Institute, Mitsubishi Materials Corp., Kitamoto, Saitama 364-0022, JAPAN)

Abstract:
Two new types of power-module structures were developed to enhance the thermal performance of direct bonded aluminum substrates with an Al alloy base plate (type 0) by combining Al with Cu. In the type I module structure, the upper Al of a type 0 structure was replaced with Cu by a newly developed Cu/AlN direct bonding method. In the type II module structure, Cu was directly bonded to the upper Al of a type 0 structure by the solid-phase diffusion bonding technique. We confirmed that these new advanced module structures exhibit high thermal performance and high reliability.