New power-module structures consisting of both Cu and Al bonded to AlN substrates with an Al base plate

Abstract:
Two new types of power-module structures were developed to enhance the thermal performance of direct bonded aluminum substrates with an Al alloy base plate (type 0) by combining Al with Cu. In the type I module structure, the upper Al of a type 0 structure was replaced with Cu by a newly developed Cu/AlN direct bonding method. In the type II module structure, Cu was directly bonded to the upper Al of a type 0 structure by the solid-phase diffusion bonding technique. We confirmed that these new advanced module structures exhibit high thermal performance and high reliability.