Low Cost 3D-Depth and Thermal Sensor Trends and Applications

Conference: Energieautarke Sensorik - Beiträge des 7. GMM-Workshops
02/24/2014 - 02/25/2014 at Magdeburg, Deutschland

Proceedings: GMM-Fb. 79: Energieautarke Sensorik

Pages: 5Language: englishTyp: PDF

Personal VDE Members are entitled to a 10% discount on this title

Authors:
Link, Thomas; Baraba, Marin (MicroMountains Applications AG, Villingen-Schwenningen, Germany)

Abstract:
The proliferation of highly integrated sensors continues to drive innovation in applications such as depth imaging. Improved image chip technologies and the increased demand for 3D systems from the consumer sectors converge and create disruptive applications in the industrial sector as well. Whereas previously high cost and low performance made the utilization of 3D-image sensors inefficient, the current improvements open a wide array of cost efficient applications. Similar things can be said in the field of thermal imaging, where advancements start to penetrate the consumer market as well, enabling industrial low cost solutions.