Development of Tin-Seal Technology for Gold Reduction in Gold-Nickel Contacts
Conference: ICEC 2014 - The 27th International Conference on Electrical Contacts
06/22/2014 - 06/26/2014 at Dresden, Deutschland
Proceedings: ICEC 2014
Pages: 6Language: englishTyp: PDF
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Authors:
Chou, George J. S. (Corporate Technology, TE Connectivity, Harrisburg, PA, USA)
Abstract:
Deposition and subsequent heat-treatment of a tinseal layer underneath nickel has demonstrated excellent protection against detrimental copper creep corrosion on a flash thin gold finish of 5 microinch (0.13 µm). Stable and low contact resistances are measured on the flash thin gold-nickel with the tin-seal after 5-day mixed flowing gas (MFG) class IIA exposure. Use of tin-seal technology can enable the use of thinner gold for contact applications to achieve gold reduction.