Development of a Novel Highly Conductive Aluminum Particle based Filler for Low Density Conductive Composites
Conference: ICEC 2014 - The 27th International Conference on Electrical Contacts
06/22/2014 - 06/26/2014 at Dresden, Deutschland
Proceedings: ICEC 2014
Pages: 6Language: englishTyp: PDF
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Authors:
Freckmann, Dominique (TE Connectivity (TE), Menlo Park, CA, USA)
Myers, Marjorie (TE Connectivity (TE), Harrisburg, PA, USA)
Schmidt, Helge (TE Connectivity (TE), Bensheim, Germany)
Abstract:
To provide a light weight filler material for low density conductive composites, a novel aluminum based system is being developed. A simple zincate solution of zinc oxide and caustic soda is used for coating the Al particles. The influence of various factors on this process, such as concentration, temperature, times, and additives, are reported. Additionally, the zinc/aluminum particles were coated with tin resulting in desirable low powder resistivity values comparable to copper particles.