Power Embedding – the paradigm shift in interconnect Technology

Conference: Elektronische Baugruppen und Leiterplatten – EBL 2016 - 8. DVS/GMM-Tagung
02/16/2016 - 02/17/2016 at Fellbach, Deutschland

Proceedings: GMM-Fb. 84: Elektronische Baugruppen und Leiterplatten – EBL 2016

Pages: 5Language: englishTyp: PDF

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Authors:
Rössle, Christian; Gottwald, Thomas (Schweizer Electronic AG, Einsteinstr. 10, 78713 Schramberg, Deutschland)

Abstract:
Miniaturization of Power Electronic modules requires the minimization of losses and optimized power dissipation. The p² Pack technology makes it possible to build ultra-thin modules with a thickness of 1-1.4 mm which have less losses and improved power dissipation characteristics by using embedding technologies and processes of the Printed Circuit Board industry.