Investigation of the ultrasonic ribbon bonding process on electronic power modules

Conference: Elektronische Baugruppen und Leiterplatten – EBL 2016 - 8. DVS/GMM-Tagung
02/16/2016 - 02/17/2016 at Fellbach, Deutschland

Proceedings: GMM-Fb. 84: Elektronische Baugruppen und Leiterplatten – EBL 2016

Pages: 4Language: englishTyp: PDF

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Song, J.; Dörfler, F.; Guyenot, M. (Robert Bosch GmbH, Renningen, Germany)
Schmauder, S. (Institute for Materials Testing, Materials Science and Strength of Materials (IMWF), University of Stuttgart, Stuttgart, Germany)

The input parameters of the ultrasonic ribbon bonding process, i.e., the ultrasonic energy and the normal force applied on the aluminum ribbon, play a significant role on the bonding quality. In this work, the ultrasonic ribbon bonding process on power modules is investigated experimentally in order to understand the underlying physical mechanisms of the process and the bonding parameter influences on this. Therefore, two kinds of experiments are implemented to detect the input parameters sensitivity. In the first group, the effects of ultrasonic power are analyzed on the macroscopic level. That is, for each bonding process, different ultrasonic power profiles, different stable values and ramping time, are employed, while the normal forces are identical and constant values all the time. For the other kind of experiments, identical ultrasonic profile and varying normal forces are applied. In addition, the local microstructure response of the aluminum ribbon on the bonding process is analyzed by means of grain size distribution images.