Dimensioning of a Novel Design Concept for MMC Submodules
Conference: CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
03/08/2016 - 03/10/2016 at Nürnberg, Deutschland
Proceedings: ETG-Fb. 148: CIPS 2016
Pages: 6Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Waltrich, U.; Ruccius, B.; Malipaard, D.; Schletz, A.; Maerz, M. (Fraunhofer Institute for Integrated Systems and Device Technology (IISB), Schottkystr. 10, 91058 Erlangen, Germany)
Modular multilevel converters (MMC) comprise of a multitude of identical submodules. Current high power systems for power transmission (i.e. HVDC) use state of the art industrial power semiconductor modules. Great improvements are possible by optimizing the construction of the power modules towards the special boundary conditions in MMCs. A promising concept is to mount the top switch directly onto the heat sink. This measure removes unnecessary thermal and electrical isolation barriers. Moreover considering copper heat buffers as semiconductor top-side contacts, module as well as auxiliary safety components can be saved because of an increased intrinsic failure capability. In this work the approach of designing such 6.5 kV submodules for a 1280 MVA system by electrical and thermal simulations is given. Furthermore thermal measurements are carried out to review the thermal simulations and compare different assemblies.