Potential failure risks causing delamination of sinter joints
Conference: CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems
03/08/2016 - 03/10/2016 at Nürnberg, Deutschland
Proceedings: CIPS 2016
Pages: 7Language: englishTyp: PDF
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Authors:
Boettge, Bianca; Reissaus, Stephan; Klengel, Sandy (Fraunhofer Institute for Microstructure of Materials and Systems IMWS, 06120 Halle, Germany)
Abstract:
The objective of this basic research is to gain more fundamental knowledge and understanding of delamination appearance in silver-sintered components. Therefore, surface-sensitive Time-of-Flight Secondary Ion Mass Spectrometry (ToF-SIMS) in combination with high resolution Scanning and Transmission Electron Microscopy (SEM, TEM) was carried out on diode chips with a silver-finish on top and on copper surfaces of Direct Copper Bonded (DCB) substrates after different storage conditions and cleaning steps. The investigation of chip surfaces was concentrated on polydimethylsiloxane (PDMS) residues from dicing tape as well as on sulfur and organic contaminations from atmosphere. Furthermore, the copper surface of DCB substrates was investigated with focus on base metal oxidation.