High-Speed Photonics for Side-by-Side Integration with Billion Transistor Circuits in Unmodified CMOS Processes

Conference: ECOC 2016 - 42nd European Conference on Optical Communication
09/18/2016 - 09/22/2016 at Düsseldorf, Deutschland

Proceedings: ECOC 2016

Pages: 3Language: englishTyp: PDF

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Authors:
Alloatti, Luca (Massachusetts Institute of Technology, Cambridge, MA 02139, USA & Now at Institute of Electromagnetic Fields (IEF), ETH Zurich, Zurich, Switzerland)

Abstract:
Monolithic integration of photonics and electronics is key to chip-to-chip optical interconnects. However, high-yield CMOS nodes impose strict constraints on materials and design rules. We review high-responsivity photodiodes and low-voltage modulators for 12.5Gbaud links in an unmodified 45nm CMOS node.