Characterization of a Packaged Network on Chip based on Multi-Microrings
Conference: ECOC 2016 - 42nd European Conference on Optical Communication
09/18/2016 - 09/22/2016 at Düsseldorf, Deutschland
Proceedings: ECOC 2016
Pages: 3Language: englishTyp: PDF
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Authors:
Faralli, Stefano; Chiesa, Marco (INPHOTEC center, Scuola Superiore Sant’Anna, Pisa, Italy)
Cerutti, Isabella; Andriolli, Nicola (Scuola Superiore Sant’Anna, Pisa, Italy)
Gambini, Fabrizio; Pintus, Paolo (Scuola Superiore Sant’Anna, Pisa, Italy & CNIT, Pisa, Italy)
Preve, Giovan Battista (INPHOTEC center, Scuola Superiore Sant’Anna, Pisa, Italy & CNIT, Pisa, Italy & Nanophotonics Technology Center, Universidad Politécnica de Valencia, Valencia, Spain)
Ortuno, Ruben (Nanophotonics Technology Center, Universidad Politécnica de Valencia, Valencia, Spain)
Abstract:
A multi microring network on chip with 6 ports has been fabricated in SOI, packaged and characterized. The BER penalty for two simultaneous 10Gb/s transmissions of up to 5 hops is below 1 dB at a BER of 10-9.