Simulation-Based Design Methodology for Heterogeneous Systems at Package-Level Utilizing XML and XSLT

Conference: Zuverlässigkeit und Entwurf - 9. ITG/GMM/GI-Fachtagung
09/18/2017 - 09/20/2017 at Cottbus, Deutschland

Proceedings: ITG-Fb. 274: Zuverlässigkeit und Entwurf

Pages: 8Language: englishTyp: PDF

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Authors:
Fischbach, Robert; Heinig, Andy (Fraunhofer Institute for Integrated Circuits, Division Engineering of Adaptive Systems, Dresden, Germany)
Lienig, Jens (TU Dresden, Institute of Electromechanical and Electronic Design, Dresden, Germany)

Abstract:
System-in-Package is an appealing alternative compared to the integration on a PCB or in a chip. A big variety of different packaging solutions (including 2.5/3D integration) makes it difficult to choose the most appropriate solution for a given specification. Simulation-based design flows gain importance, but lack the straightforward access to actual design data. We propose a new description format as well as a corresponding methodology to manage and process assembly and packaging design data. Based on established software concepts (XML/XSLT), our Assembly Description Format (ADF) integrates well into existing design environments and features a high flexibility to consider distinct design aspects.