Investigation of Mass Transfer Speed Theory on chemical mechanical polishing
Conference: ICPT 2017 - International Conference on Planarization/CMP Technology
10/11/2017 - 10/13/2017 at Leuven, Belgium
Proceedings: ICPT 2017
Pages: 8Language: englishTyp: PDF
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Authors:
Liu, Yuling; Li, Yanlei; Wang, Chenwei; Yang, Liu; Wang, Jianchao (Institue of Microelectronics, Hebei University of Technology, Tianjin, 300130)
Abstract:
Abstract: A more complete theoretical system about chemical mechanical planarization (CMP) of the single material or various materials in the same plane was proposed， which studied from the mechanics, tribology, physics, physical chemistry, materials engineering, microelectronics engineering, chemistry, computer and other disciplines, comprehensively. And with the theoretical direction, the adjustable engineering technology and materials can apply different products was researched, which achieved higher cost performance and multiplier effect. Keywords: Mass transfer speed, theory, chemical mechanical polishing