Advanced Optical Particle Sizing for Non-Invasive Slurry analysis

Conference: ICPT 2017 - International Conference on Planarization/CMP Technology
10/11/2017 - 10/13/2017 at Leuven, Belgium

Proceedings: ICPT 2017

Pages: 5Language: englishTyp: PDF

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Authors:
Mavliev, Rashid (Ipgrip LLC, Campbell, CA, 95008, USA)

Abstract:
Slurry is one of most critical yield defining components of CMP process and potential source of problems. Timely and proper monitoring of slurry parameters is critical for CMP yield improvement. Slurry is very complex system – the combination of chemistry and nanoparticles with wide range of parameters. Metrology of slurry parameters could be done in 3 levels– supplier manufacturing/delivery site, Slurry Delivery Systems (SDS) in subfab and point-of-use (POU), with very different time requirements, size and concentration limits on each level. Measuring of undiluted slurry in real time with multisensor enhanced Single Particle Optical Sizer (ME SPOS) is possible on each level of slurry delivery and handling. ME SPOS is best technology for non-invasive slurry analysis. Keywords: Planarization, Chemical-mechanical Polishing, slurry, particles, optical, sizing.