Novel Method for Nano-Surface Analysis of Cu CMP Chemicals by AFM and Microfluidic Chip System
Conference: ICPT 2017 - International Conference on Planarization/CMP Technology
10/11/2017 - 10/13/2017 at Leuven, Belgium
Proceedings: ICPT 2017
Pages: 6Language: englishTyp: PDF
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Authors:
Ryu, Heon-Yul; Han, Kwang-Min; Cho, Byoung-Jun (Department of Bio-Nano Technology, Hanyang University ERICA, Ansan 15588, Korea)
Shima, Shohei; Hamada, Satomi; Hiyama, Hirokuni (EBARA Corporation, Fujisawa, Kanagawa 251-8502, Japan)
Kim, Tae-Gon (imec, Kapeldreef, Leuven 3001, Belgium)
Park, Jin-Goo (Department of Bio-Nano Technology & Department of Materials Science & Chemical Engineering, Hanyang University ERICA, Ansan 15588, Korea)
Abstract:
A new method for nano-surface analysis with selective surface treatment is presented in this paper. With this method, the surface of interest is treated with chemicals selectively by using fluidics chip and boundaries of treated surface were analyzed by atomic force microscope. Through measuring the surface level relative to the untreated region, chemical-surface interactions could be assumed. Well-known Cu CMP slurry chemical components such as citric acid, hydrogen peroxide, and benzotriazole were treated on the copper surface with the above-mentioned experimental set, then the etch depth, grown/adsorbed layer thickness, and surface roughness were characterized by AFM measurement. Keywords: Cu slurry chemicals, Microfluidics chip, Atomic force microscope, Selective surface treatment, Step height measurement