Surface Flatness and Roughness Synchronized Control in CMP Process of Silicon Mirror

Abstract:
In high-energy laser system, the silicon mirror is applied to reflect high-energy laser, which is vital for system performance. In order to guarantee favorable absorption and scattering rate of laser, the surface flatness and roughness of slicon mirror need to be controlled at the same time, which is a huge challenge for engineers in actual manufacture. A conventional technological process usually include three steps, fine grinding, chemical mechanical polishing (CMP) and ion beam processing. This paper presents a simple and effective solution to achieve silicon mirror’s surface flatness and roughness synchronized control in CMP process, as a preparation for follow-up process. Furthermore, its practical application and future work are also discussed. Keywords: Surface Flatness and Roughness, Synchronized Control, CMP, Silicon Mirror