A Study of Cu inhibitor removal by alkaline agent in post CMP cleaning process
Conference: ICPT 2017 - International Conference on Planarization/CMP Technology
10/11/2017 - 10/13/2017 at Leuven, Belgium
Proceedings: ICPT 2017
Pages: 5Language: englishTyp: PDF
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Authors:
Gao, Baohong; Tan, Baimei; Liu, Yuling (Hebei University of Technology, Tianjin, 300130, China)
Abstract:
In this paper, it used an alkaline based chelating agent compared with Tetraethyl ammonium hydroxide (TEAH) to remove copper inhibitor residue (Cu-BTA) on the post CMP Cu surface. All the samples are detected by SEM and XPS. The results show that the alkaline based chelating agent is more efficient in removing the Cu-BTA from the Cu surface than TEAH, and leaving the cuprous oxide to passivate the Cu surface. 5 – 10 Keywords should be chosen so that they describe the contents of the paper. They should be typed below this abstract with a single line spacing, starting with the word “Keywords”. Keywords: CMP; cleaning; BTA; alkaline; XPS