Research on Multi-Method Endpoint Detection in Chemical Mechanical Planarization Process
Conference: ICPT 2017 - International Conference on Planarization/CMP Technology
10/11/2017 - 10/13/2017 at Leuven, Belgium
Proceedings: ICPT 2017
Pages: 5Language: englishTyp: PDF
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Authors:
Li, Hongkai; Lu, Xinchun; Luo, Jianbin (Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China)
Abstract:
Endpoint Detection (EPD) technology plays a critical role for the chemical mechanical planarization (CMP) process, and there is a strong interest in developing this technology. In the paper, an EPD system using multi-methods was developed and integrated into the CMP system. Applying the different detection methods, the EPD experiments of the Cu CMP process were carried out. The experiment results showed that the system could accurately determine the CMP endpoint and work steady. Keywords: Chemical Mechanical Planarization, End-point Detection, Eddy Current, Optical Method, Motor Power