A New Approach for In-Line Heat Chuck Temperature Measurement Based on SAW Technology
Conference: MikroSystemTechnik 2017 - Kongress
10/23/2017 - 10/25/2017 at München, Deutschland
Proceedings: MikroSystemTechnik 2017
Pages: 3Language: englishTyp: PDF
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Authors:
Lenzhofer, Martin (CTR Carinthian Tech Research AG, Europastr. 12, 9524 Villach, Austria)
Stocksreiter, Wolfgang (FH JOANNEUM, Institut Electronic Engineering, Werk-VI-Str. 46, 8605 Kapfenberg, Austria)
Szirch, Stefan (Infineon Technologies Austria AG, Siemensstr. 2, 9500 Villach, Austria)
Abstract:
In this paper a new approach of using the surface acoustic wave (SAW) technology in modern prober testing systems of semiconductor facilities for calibration purposes is presented. Currently just wafers with wired sensor elements are used that are very expensive and require manual handling. Also the prober equipment itself must be removed from the line. If using wirelessly interrogated passive SAW sensors, no difficult handling is necessary anymore and additionally the wafer can be loaded automatically into the machine, which saves maintenance time and even reduce material costs. This paper shows the feasibility of implementing SAW sensors directly on the surface of a wafer and presents first measurement results and performance characteristics of the realized system.