Integration of complex miniaturized optical systems by place and bend assembly

Abstract:
The high volume integration of miniaturized systems with complex – especially off axis – optics is often limited by 3D alignment issues and the associated costs for manual process steps. Applications arise in several fields of applications like mobile food analysis using smartphone based spectrometers or multispectral cameras for autonomous operating vehicles. A new approach named “Place and Bend Assembly” has been established. The design of the planar substrates includes bending line structures which enable bending up walls and top of a 3D body after the assembly of the system components by standard 2D assembly tools. The optical path inside adjusts itself automatically if the accuracy of the process is suffi-ciently high. The proof of concept has been achieved by bending a fully reflective camera device. Now a f / 1.4 thermal infrared camera has been realized. Future work is intended towards multispectral camera systems and NIR spectrometers. Material prop-erties and production technologies for the substrates will be optimized for higher performance and lower cost.