SAM³: New Failure Analysis Methods for Heterogeneous Systems
Conference: MikroSystemTechnik 2019 - Kongress
10/28/2019 - 10/30/2019 at Berlin, Deutschland
Proceedings: MikroSystemTechnik Kongress 2019
Pages: 4Language: englishTyp: PDF
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Authors:
Schweinboeck. Thomas (Infineon Technologies AG, 85579 Neubiberg, Germany)
Pressel, Klaus (Infineon Technologies AG, 93049 Regensburg, Germany)
Altmann, Frank (Fraunhofer Institute for Microstructure of Materials and Systems (IMWS), 06120 Halle, Germany)
Hoffrogge, Peter (PVA TePla AS, 73463 Westhausen, Germany)
Grimm, Michael; Keiper, Bernd (3D-Micromac, 09126 Chemnitz, Germany)
Abstract:
SAM3 (“Smart Analysis Methods for 3D Integration in Advanced Microsystems and Corresponding Materials”) was a French/German funded project dealing with research and development on new methods for failure analysis of advanced semiconductors and System-in-Package solutions. The project included French and German semiconductor and system suppliers, small and medium sized equipment suppliers, as well as R&D institutes. The project focused on three major topics: advanced fault isolation and defect localization, new sample preparation tools and their combinations, and advanced material characterization. In close collaboration between the different partners, new failure analysis related methods and new failure analysis flows have been investigated. In our contribution, we present selected results of new techniques including GHz Scanning Acoustic Microscopy, various laser techniques, as well as sample preparation using focused ion beam techniques and Raman-based stress characterization.