Surface-Mount Package IPM with Highly Reliable Transfer Molding Resin

Conference: CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
03/24/2020 - 03/26/2020 at Berlin, Deutschland

Proceedings: ETG-Fb. 161: CIPS 2020

Pages: 5Language: englishTyp: PDF

Hodaka, Rokubuichi,; Harada, Hiroyuki; Hiramatsu, Seiki (Advanced Technology R&D Center, Mitsubishi Electric Corporation, Japan)
Sakamoto, Ken; Iwai, Takamasa (Component Production Engineering Center, Mitsubishi Electric Corporation, Japan)
Kosugi, Akira; Shikano, Taketoshi (Power Device Works, Mitsubishi Electric Corporation, Japan)

A surface-mount package IPM (intelligent power module) has been developed. A reverse conducting IGBT and highly thermal conductive transfer molding resin were used to minimize package size and reduce the cost. For surface-mount type devices, hygroscopic reflow resistance is a key issue and the developed module can satisfy moisture sensitivity level (MSL) 3 due to the improvement of adhesion property of the transfer molding resin. The device reliability was evaluated by H3TRB and HTRB, and it was proven that a highly reliable surface-mount package IPM could be realized.