Thermal Analysis of Power Module with Double Sided Direct Cooling using Ceramic Heat Sinks

Conference: CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
03/24/2020 - 03/26/2020 at Berlin, Deutschland

Proceedings: ETG-Fb. 161: CIPS 2020

Pages: 5Language: englishTyp: PDF

Botter, Nicolas (Univ. Grenoble Alpes, CNRS, Grenoble INP, G2Elab, 38000 Grenoble, France & Safran Tech, 78772 Magny-les-Hameaux, France)
Avenas, Yvan (Univ. Grenoble Alpes, CNRS, Grenoble INP, G2Elab, 38000 Grenoble, France)
Missiaen, Jean-Michel; Bouvard, Didier (Univ. Grenoble Alpes, CNRS, Grenoble INP, SIMAP, 38000 Grenoble, France)
Khazaka, Rabih (Safran SA, Safran Tech, 1 rue des jeunes bois, Châteaufort, CS 80112, 78772 Magny-les-Hameaux, France)

In this paper, a double sided liquid cooled power module using ceramic heat sinks is presented. This new architecture decreases drastically the number of layers comparing to conventional power modules. Particular care has been taken to select materials with high operating temperatures (175deg C) in order to fully use the range of temperature of SiC used components. Tracks and die attaches of the innovative power module are both made of sintered silver. The impact of the temperature profile during the sintering process on the porosity of silver has been investigated. Porosity of 10% and 30% have been reached after 1 hour at a sintering temperature of 500deg C and 320deg C, respectively, without pressure implementation. The evaluation of the thermal behavior of this packaging technique is proposed in this paper. Results show that the junction to ambient thermal resistance can be lower than 0.3W.m-1K-1 for flow rate values above 15L.min-1.