WBG power semiconductor packaging with advanced interconnection technologies
Conference: CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
03/24/2020 - 03/26/2020 at Berlin, Deutschland
Proceedings: ETG-Fb. 161: CIPS 2020
Pages: 5Language: englishTyp: PDF
Suganuma, Katsuaki (Institute of Scientific and Industrial Research, Osaka University, 8-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan)
Sinter joining technology has attracted much attention as the new interconnection technology which realizes both high performance and high reliability for WBG devices. The author has developed Ag sinter joining with a hybrid of Ag micron/submicron size particles providing excellent heat-resistance beyond 200 °C. Ag reacts with oxygen in air resulting in low temperature sintering around 200 °C. The microporous joining structure provides high strength as well as excellent heat/electric conductivity. The die-attached devices are stable even up to 250 °C in thermal shock and power cycling. The latest progress of sinter joining is summarized.