End-of-life mechanism due to cyclic thermomechanical loading of power modules with .XT joining technology

Conference: CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
03/24/2020 - 03/26/2020 at Berlin, Deutschland

Proceedings: ETG-Fb. 161: CIPS 2020

Pages: 5Language: englishTyp: PDF

Methfessel, Torsten; Jaehme, Hendrik (Infineon Technologies AG, Warstein, Germany)

Further investigation results from power-cycling (PC) tests with Infineon .XT PrimePACK(TM) power modules and low cycle times reveal a significant change in the running time until end of life (EOL) as well as a predominant aging mechanism compared to power modules with standard joining technology. While the standard technology shows a Vce increase caused by a bond-wire detachment as the most prominent EOL mechanism, the .XT reaches EOL via Rth increase, mostly due to a degradation of the underlying substrate-to-base-plate solder layer (substrate solder).