Two-layered planar SiC power module for industrial applications
Conference: CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
03/24/2020 - 03/26/2020 at Berlin, Deutschland
Proceedings: ETG-Fb. 161: CIPS 2020
Pages: 4Language: englishTyp: PDF
Raab, Oliver; Kriegel, Kai; Ghesquiere, Pol (Siemens AG, Munich, Germany)
Within the frame of the PENTA funded project CosmoDU a highly integrated motor and its power electronics for driving industrial applications in the 10kW region are developed. The required high compactness of the power-electronic part is achieved by using wide-bandgap SiC semiconductors and new packaging approaches. In this paper a novel planar packaging technology based on a two-layer build-up is described. The manufacturing of first prototypes and the different process steps are described in detail. Finally, the resulting power modules are tested in terms of leakage current and MOSFETs output characteristic.