Design, Manufacturing and Evaluation of a Highly Integrated Low-Voltage High-Current Inverter

Conference: CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
03/24/2020 - 03/26/2020 at Berlin, Deutschland

Proceedings: ETG-Fb. 161: CIPS 2020

Pages: 5Language: englishTyp: PDF

Le Lesle, Johan; Quemener, Vincent; Morrand, Julien; Perrin, Remi; Mrad, Roberto; Mollov, Stefan (Mitsubishi Electric R&D Centre Europe, Rennes, France)

This paper presents the design, manufacturing and evaluation of a highly integrated power converter that incorporates two three phase full bridge inverters. The converter is built using Printed Circuit Board (PCB) die embedding technology. This process requires copper metallised semiconductors, applied to low-voltage Si MOSFET devices. Two metallisation processes, thermal vapour deposition and E-beam deposition are compared. The impact of both metallisation methods on power devices electrical behaviour is investigated. Then, the PCB assembly process of the highly integrated power module is introduced. Finally, the electrical performances of the converter are evaluated, highlighting the benefit of heterogeneous integration.