Introducing the LEGO Mission Profile Analysis Methodology
Conference: CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
03/24/2020 - 03/26/2020 at Berlin, Deutschland
Proceedings: ETG-Fb. 161: CIPS 2020
Pages: 5Language: englishTyp: PDF
Fogsgaard, Martin Bendix; Iannuzzo, Francesco (Aalborg University, Aalborg, Denmark)
This manuscript will introduce a novel mission profile analysis methodology for reliability analyses such as health monitoring and lifetime estimation. The model deconstructs the mission profile into stress event bricks which, when combined, can report the health and damage state of the analysed system. The manuscript will detail the methodology. Special focus will be placed on the categorising steps in the methodology. The resulting data from the analysis provide several insights into the application and the mission profile. The methodology can be used as the loading input to improve lifetime and optimise loading profile. Using the methodology on a mission profile to compare to a power cycling strategy will enable a quantifiable analysis of the acceleration factor between the two.